All 11th Gen ‘Rocket Lake’ CPUs will be compatible with previous-gen 400-series chipsets except the low-end B460 and H410, and all 10th Gen ‘Comet Lake’ CPUs will continue to work with new 500-series motherboards. You’ll need a 500-series motherboard to harness PCIe 4.0, integrated USB 3.2 Gen 2×2, and faster DMI interconnect with the latest CPUs. Interestingly, Intel now allows memory overclocking on even mid-range 500-series motherboards.
Intel® Core™ i9-11900K Processor (16M Cache, up to 5.30 GHz) Specifications
Essentials
Product Collection 11th Generation Intel® Core™ i9 Processors
Code Name Products formerly Rocket Lake
Vertical Segment Desktop
Processor Number i9-11900K
Status Launched
Launch Date Q1’21
Lithography 14 nm
Recommended Customer Price in USD $539 and BDT৳45,676.
Use Conditions PC/Client/Tablet
CPU Specifications
# of Cores 8
# of Threads 16
Processor Base Frequency 3.50 GHz
Max Turbo Frequency 5.30 GHz
Intel® Thermal Velocity Boost Frequency 5.30 GHz
Cache 16 MB Intel® Smart Cache
Bus Speed 8 GT/s
Intel® Turbo Boost Max Technology 3.0 Frequency ‡ 5.20 GHz
Intel® Turbo Boost Technology 2.0 Frequency‡ 5.10 GHz
TDP 125 W
Configurable TDP-down Frequency 3.00 GHz
Configurable TDP-down 95 W
Supplemental Information
Embedded Options Available No
Memory Specifications
Max Memory Size (dependent on memory type) 128 GB
Memory Types DDR4-3200
Max # of Memory Channels 2
Max Memory Bandwidth 50 GB/s
ECC Memory Supported ‡ No
Processor Graphics
Processor Graphics ‡ Intel® UHD Graphics 750
Graphics Base Frequency 350 MHz
Graphics Max Dynamic Frequency 1.30 GHz
Graphics Video Max Memory 64 GB
Execution Units 32
4K Support Yes, at 60Hz
Max Resolution (HDMI)‡ 4096×2160@60Hz
Max Resolution (DP)‡ 5120 x 3200 @60Hz
Max Resolution (eDP – Integrated Flat Panel)‡ 5120 x 3200 @60Hz
DirectX* Support 12.1
OpenGL* Support 4.5
Intel® Quick Sync Video ‡ Yes
Intel® InTru™ 3D Technology ‡ Yes
Intel® Clear Video HD Technology ‡ Yes
Intel® Clear Video Technology ‡ Yes
# of Displays Supported ‡ 3
Device ID 0x4C8A
OpenCL* Support 3.0
Expansion Options
Scalability 1S Only
PCI Express Revision 4.0
PCI Express Configurations ‡ Up to 1×16+1×4, 2×8+1×4, 1×8+3×4
Max # of PCI Express Lanes 20
Package Specifications
Max CPU Configuration 1
Thermal Solution Specification PCG 2019A
Intel® Thermal Velocity Boost Temperature 70 °C
TJUNCTION 100°C
Package Size 37.5 mm x 37.5 mm
Advanced Technologies
Intel® Deep Learning Boost (Intel® DL Boost) ‡ Yes
Intel® Thermal Velocity Boost ‡ Yes
Intel® Turbo Boost Max Technology 3.0 ‡ Yes
Intel® Turbo Boost Technology ‡ 2.0
Intel vPro® Platform Eligibility ‡ Yes
Intel® Hyper-Threading Technology ‡ Yes
Intel® Virtualization Technology (VT-x) ‡ Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ Yes
Intel® VT-x with Extended Page Tables (EPT) ‡ Yes
Intel® 64 ‡ Yes
Instruction Set 64-bit
Instruction Set Extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Idle States ‡ Yes
Enhanced Intel SpeedStep® Technology ‡ Yes
Thermal Monitoring Technologies ‡ Yes
Intel® Identity Protection Technology ‡ Yes
Intel® Stable Image Platform Program (SIPP) ‡ Yes
Intel® Gaussian and Neural Accelerator 2.0 ‡ Yes
Security & Reliability
Intel® AES New Instructions ‡ Yes
Secure Key ‡ Yes
Intel® Software Guard Extensions (Intel® SGX) ‡ No
Intel® OS Guard ‡ Yes
Intel® Trusted Execution Technology ‡ Yes
Execute Disable Bit ‡ Yes
Intel® Boot Guard Yes